CAD Translation
UltraSource routinely works with customer CAD data in DXF, AutoCAD DWG, Gerber, or GDS formats. We translate and repair customer CAD designs created in the different CAD systems in order to make it usable in manufacturing.
UltraSource routinely works with customer CAD data in DXF, AutoCAD DWG, Gerber, or GDS formats. We translate and repair customer CAD designs created in the different CAD systems in order to make it usable in manufacturing.
We have no quality issues with product from UltraSource, the quality is always perfect.
We will be moving to approve UltraSource as a Self-Release Supplier (removing on-site Source Inspection). Only a small fraction of our Suppliers have achieved this level of certification.
Customer supplied CAD designs are drafted into a step & repeat pattern in order to maximize substrate yield and provide the lowest cost and highest quality thin film devices. Etch factors, alignment features, and photomask polarity are added according to the specific thin film process and/or substrate requirements.
A basic understanding of thin film resistor design is required if you want to integrate sheet resistors into your circuit. Thin film sheet resistors are typically fabricated by sputtering a film of Tantalum-Nitride (TaN) under the conductor layer and then selectively etching the resistor elements. TaN resistors are very stable and reliable after they [...]
The substrate is the foundation on which the thin film components are built. The substrate properties have significant influence on the performance of the device. Alumina is still the most common substrate material due to its surface quality, cost, and high frequency performance. For power applications, Aluminum Nitride and BeO substrates are still the [...]
A basic understanding of thin film resistor fabrication can assist you in your circuit design. Thin film resistors are fabricated by sputtering a high-resistance film of Tantalum- Nitride (TaN) or NiChrome (NiCr) under the conductor layer and selectively etching the resistor elements. LEARN MORE
The substrate is the foundation on which the thin film components are built. The substrate properties have significant influence on the performance of the device. Alumina is still the most common substrate material due to its surface quality, cost, and high frequency performance. For power applications, Aluminum Nitride and BeO substrates are still the choices. [...]
USI's Management Tools This newsletter is #3 in a 10-part series to explain the 10 great management tools that we use to help us be the thin film circuit supplier that you can really depend on. Continuous Improvement Employee Training & Certification On-Time Shipping Infrastructure ITAR Controls Change Controls & Certification [...]
Plated Through Holes and Filled Vias UltraSource offers two options for pass-through conductance. First, we offer highly reliable plated through-holes, with diameters as low as 50% of the substrate thickness. These through-holes are laser drilled, de-slagged and repetitively cleaned for optimum metallization adhesion, and they are sputtered from each substrate side for maximum [...]