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So far Thin Film has created 77 blog entries.

Conductor / Resistor Films

A basic understanding of thin film resistor design is required if you want to integrate sheet resistors into your circuit. Thin film sheet resistors are typically fabricated by sputtering a film of Tantalum-Nitride (TaN) under the conductor layer and then selectively etching the resistor elements. TaN resistors are very stable and reliable after they [...]

2017-06-18T22:22:14-04:00February 14th, 2017|Design Guidelines|0 Comments

Substrate Material Properties

The substrate is the foundation on which the thin film components are built. The substrate properties have significant influence on the performance of the device. Alumina is still the most common substrate material due to its surface quality, cost, and high frequency performance. For power applications, Aluminum Nitride and BeO substrates are still the [...]

2017-02-14T16:57:07-05:00February 13th, 2017|Design Guidelines|0 Comments

Substrates

The substrate is the foundation on which the thin film components are built. The substrate properties have significant influence on the performance of the device. Alumina is still the most common substrate material due to its surface quality, cost, and high frequency performance. For power applications, Aluminum Nitride and BeO substrates are still the choices. [...]

2017-05-01T15:19:12-04:00February 8th, 2017|Services|0 Comments

Management Tool #3 is: On-Time Shipping

USI's Management Tools This newsletter is #3 in a 10-part series to explain the 10 great management tools that we use to help us be the thin film circuit supplier that you can really depend on. Continuous Improvement Employee Training & Certification On-Time Shipping Infrastructure ITAR Controls Change Controls & Certification [...]

2017-04-19T11:44:26-04:00February 6th, 2017|News|0 Comments

Plated Through-Holes and Filled Vias

Plated Through Holes and Filled Vias UltraSource offers two options for pass-through conductance. First, we offer highly reliable plated through-holes, with diameters as low as 50% of the substrate thickness. These through-holes are laser drilled, de-slagged and repetitively cleaned for optimum metallization adhesion, and they are sputtered from each substrate side for maximum [...]

2017-02-15T15:21:53-05:00February 4th, 2017|Design Guidelines|0 Comments
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