Gold or ENEPIG plating can be added to sputtered films for applications when plating is required. Gold plating is used to build up thin film coatings and ENEPIG is used to provide solderability and wire bondability from the same metallization.
Photoresist, the photo-sensitive coating that enables patterning, is applied to thin film substrates via a robotic spray system.
Custom mask aligners and tooling are used to ensure that front side and back side patterns are aligned to each other to within ± 24 microns (± .001”) of each other.
UltraSource, Inc. provides thin film metalization and patterning services that allow our customers to hermetically seal windows and lenses into optical, laser, and infrared assemblies. Our unique thin film metalization and patterning processes apply solderable metal coatings that provide hermetic integrity against a variety of the tough applications like space, infrared signal transmission, and medical [...]
Photolithography is the process of using light to transfer images from a photomask to a coated thin film substrate. The key to the process is the use of a light-sensitive chemical called photoresist and a precision phototool, called a photomask. The photomask is custom tooling made from customer CAD files.
New fabrication techniques that improve performance, lower assembly costs, or reduce size are always of interest. Enter Polyimide! Polyimide is a polymer material known for its thermal stability, good chemical resistance, excellent mechanical properties, and characteristic orange/yellow color. The cured film properties of polyimide allow it to be used as dielectric features in thin film [...]
USI uses a plasma enhanced chemical vapor deposition (PECVD) tool to deposit silicon nitride films for use in integrated capacitors or as a dielectric layer for multilayer thin film devices such as the UltraBridge.
CO2 lasers are used by directing the output of a high power laser through a series of optics working with a CNC system to enable machining of various thin film substrates. The 75 micron diameter laser beam is used to machine the substrate. Substrate material subjected to the laser beam melts and the molten slag [...]
Laser trimming is a process that uses a 20 micron diameter laser to ablate or burn away small portions of an individual resistor, raising the resistance value into the required tolerance value.
When high reliability bonding is desired, it is ideal to "burnish" the mating surfaces so the epoxy has a mechanical pattern for the epoxy to "key" into. Backside burnishing is a unique backside metallization treatment developed at UltraSource to enhance the adherence of thin film components to carriers by epoxies. Backside burnishing results in a [...]