Plated Through Holes and Filled Vias
UltraSource offers two options for pass-through conductance. First, we offer highly reliable plated through-holes, with diameters as low as 50% of the substrate thickness. These through-holes are laser drilled, de-slagged and repetitively cleaned for optimum metallization adhesion, and they are sputtered from each substrate side for maximum step coverage and reliability. When necessary, edge wrap around techniques, including patterned edge wraps, can connect isolated front-to-back conductors.