Plated Through-Holes and Filled Vias

Feb 4, 2017

Plated Through Holes and Filled Vias

UltraSource offers two options for pass-through conductance. First, we offer highly reliable plated through-holes, with diameters as low as 50% of the substrate thickness. These through-holes are laser drilled, de-slagged and repetitively cleaned for optimum metallization adhesion, and they are sputtered from each substrate side for maximum step coverage and reliability. When necessary, edge wrap around techniques, including patterned edge wraps, can connect isolated front-to-back conductors.

LEARN MORE ABOUT PLATED THROUGH HOLES
LEARN MORE ABOUT VIAS
2017-02-15T15:21:53+00:00 February 4th, 2017|Design Guidelines|0 Comments