USI’s thin film capacitors are called UltraCapacitors and they are fabricated by using a metal insulator metal (MIM) methodology with a silicon nitride dielectric and thin film sputtered gold electrodes. The UltraCapacitor uses a unique construction methodology in order to avoid the step coverage issues that have inhibited successful production use of thin film capacitors for many years. These thin film monolithic capacitors can be integrated into circuit designs where they offer the advantages of solid-state integration, small size, high Q, and reduced assembly requirements. Several customers have also designed their own custom high frequency chip capacitors that we build for use in critical design challenges. A typical UltraCapacitor layout that shows important design considerations is presented below.