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UltraSource, Inc. now offers this cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of the bonding. This surface treatment will often result in improved adhesion and eliminate the need for customers to “roughen up” the surface of the components themselves before bonding.
Contact UltraSource for further information on this unique backside metallization process or to request your sample so you can evaluate the process directly.
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