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NOTE: In order to serve you best with our e-newsletters, we want to hear from YOU on which specific thin film or design or manufacturing topics you want to learn more about. Please email me directly with your ideas or topics of interest at mcasper@ultrasource.com.
As we look forward to an exciting new year, all of the employees of UltraSource would like to thank you for your past support and the many opportunities you have given us to serve you!
2013 was a busy year at UltraSource that started with the publication of our e-newsletters in January 2013 as a means to communicate and easily update people on process improvements and new offerings to our thin film circuit manufacturing capabilities. We have received lots of positive feedback from existing and prospective customers on the design and content of our e-newsletters and we want you to know that we will continue what we started! As a recap, here is a summary of the e-newsletters from 2013 that we are proud to share (each title below is linked to the Process or Capability on our website):
1. UltraFast – a Rapid Prototyping Service
2. Backside Burnishing Treatment for Epoxy Adhesion Enhancement
3. How CAD File Submission Affects the Success of your Thin Film Design
4. Polyimide – Unlock the Potential of Your Thin Film Design
5. Thin Is In! Ultra-Thin Substrates
6. UltraBridge – The Alternative to Wire Bonding
7. ENEPIG – The “Universal Finish”
At UltraSource, we never stop improving or innovating. We are currently working towards a mid-2014 certification per AS9100 so we can better serve our Aerospace customers. We have improved our laser trim equipment so we can reduce future tooling costs by up to 50%. And, we have a Hi-Rel CopperVia under development that will be usable in Space and Defense applications. We look forward to serving you in 2014 and to continue to be your preferred supplier of quality thin film circuit and interconnect manufacturing services.
Wishing you a Happy and Healthy 2014 with continued success!
Michael D. Casper
CEO & President
