For many years, thin film technology has been used as an enabling fabrication technique for RF and microwave circuitry due to the technology’s excellent line resolution, superb microwave substrate properties, and highly reliable construction. As transmission frequencies push higher and higher to gain broader bandwidth and higher data flows, designers of microstrip and coplanar thin film circuits need to use Ultra-Thin substrates to enable circuit miniaturization and high frequency transmission efficiency. At UltraSource, we supply circuits on Ultra-Thin substrates in low, medium, and production volumes. UltraSource wants you to know that “Thin is In” and we can help you with your Ultra-Thin substrate requirements!
In fact, UltraSource has been fabricating thin film circuits on 3 mil (75 micron), 4 mil (100 micron), and 5 mil (125 micron) substrates for over 20 years and employs a host of tools and techniques that enable cost effective processing of Ultra-Thin substrate materials. We fabricate circuits on Ultra-Thin substrates made from:
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A key enabler for thin film technology is its ability to incorporate features that can drive high levels of miniaturization and performance like these features that can be integrated into most Ultra-Thin designs:
Plated Through Holes
Copper or Gold Filled Vias
Laser Trimmed Sheet Resistors
Nickel or TiW Solder Dams
Post Laser Machining
Double-Sided Pattern & Etching
Back-Side Burnishing for Epoxy Adhesion Enhancement
As an industry leader in delivering thin film manufacturing solutions, UltraSource, Inc. is the logical choice as your supplier for build to print thin film circuits and interconnects. We offer a vast array of breakthrough processes and integrated features that can solve many performance, cost, and assembly challenges. UltraSource, Inc. is ISO 9001 certified and registered as a defense contractor with the United States Department of State, Office of Defense Trade Controls and Compliance.