UltraSource, Inc. Releases Capabilities Addition on Ultra-Thin Substrates

Jun 15, 2014

Michael Casper, President & CEO of UltraSource, Inc. an industry leader in delivering thin film on ceramic microchip manufacturing solutions is pleased to announce the formalized addition of a new fabrication processing note on their website under Capabilities/Solutions titled: Ultra-Thin Substrates — “Thin is In! (And We Can Help)”.

For many years, thin film technology has been used as an enabling fabrication technique for RF and microwave circuitry due to the technology’s excellent line resolution, superb microwave substrate properties, and highly reliable construction. Casper explains that “Since operating frequencies are regularly pushed higher and higher to gain bandwidth and data flow improvements, we now see a market need for us to formalize the offering of fabricating circuits on Ultra-Thin substrates to our customers. That market need is being driven by a constant flow of customers asking us to build circuits on Ultra-Thin substrates on a regular basis.”

In fact, UltraSource has been fabricating thin film circuits on 3 mil (75 micron), 4, mil (micron) and 5 mil (125 micron) substrates for over 20 years but has formalized their offering of Ultra-Thin substrates this past week by adding a new webpage under “Capabilities/Solutions”. UltraSource employs a host of tools and techniques that enable cost effective processing Ultra-Thin substrate materials. We fabricate circuits on Ultra-Thin substrates made from: 99.6% Alumina, Fused Silica, Glass, Aluminum Nitride, Quartz, and Silicon.

A key enabler for thin film technology is its ability to incorporate features that can drive high levels of miniaturization and performance like these features that can be integrated into most Ultra-Thin designs: Plated Through Holes, Copper or Gold Filled Vias, Laser Trimmed Sheet Resistors, Nickel or TiW Solder Dams, Polyimide Features, Post Laser Machining, Double-Sided Pattern & Etching, and Back-Side Burnishing for Epoxy Adhesion Enhancement.

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Semiconductor Packaging News

2017-02-15T22:54:08-05:00June 15th, 2014|News|0 Comments

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