UltraSource, Inc Releases New Thin Film Microcircuit CopperVia™
Download CopperVia DataSheet PDF
Michael Casper, CEO and CTO of UltraSource, Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced today the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia™ will be introduced at the 2012 IEEE MTT-S International Microwave Symposium/Exhibition June 19th – 22nd at the Palais Des Congrès De Montréal, Quebec, Canada; UltraSource is exhibiting at booth 2802. UltraSource’s new CopperVia™ process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia™, the CopperVia™; virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.
CopperVia™ offers designers additional flexibilities for today’s thin film microcircuit applications
The new CopperVia™ process extends UltraSource’s existing portfolio feature set offering engineers additional flexibility to meet design challenges of complex and high density planar, 2.5-D, 3-D, and multilayer thin film circuitry. Casper explained that he is investing significant resources to meet today’s aggressive customer requirements for thin film microcircuit and passive element structures. “RF and microwave hybrid circuits, electronic interposers and interconnects, mandates high levels of electrical and thermal performance on various alumina ceramic based substrates” says Casper. Kevin Callery, Director of Business Development went on to explain that solid filled vias provides a low inductance, microwave grounding path, allowing high performance RF circuits to be assembled in a thermally efficient surface mount configuration. “CopperVia™ is being offered to provide engineers additional design flexibilities in meeting all of their requirements while simultaneously lowering the costs of multilayer designs. The CopperVia™ enables a lower cost thin film structure than using other precious metals for making a signal or power interconnect between planar layers of high frequency circuits and meets reliability requirements for harsh environment applications such as defense and security systems, fiber optic transceivers, infrared detection, radar, and medical applications.”
CopperVia™ added to UltraSource, Inc. Technology Platform
The CopperVia™ provides designers a cost effective technology to enable high performance DC, RF and microwave, optical structures, thin film planar and multilayer circuits, and passive component structures. The CopperVia™ has been added as an integral part of the UltraSource Technology Platform, providing designers the most comprehensive suite of thin film solutions available anywhere. The UltraSource Technology Platform offers competitive advantages for designers looking to break through to new levels of performance in the areas of integration and miniaturization, speed and signal integrity, power dissipation, reduced cost, and increased bandwidth.
About UltraSource
Founded in 1991, UltraSource, Inc. (USI) is one of the world’s largest thin film suppliers offering leading edge quick turn, custom, and volume production services of complex microcircuits for technically demanding high density analog, mixed-signal, digital, power, hybrid circuit, RF, microwave and millimeter wave applications. Electronics system design is placing increasing emphasis on high frequency performance and reduced package size; UltraSource products and services deliver thin film microcircuit solutions that enable customers to advance towards evolutionary bandwidth performance, integration, and quality. UltraSource solutions include: volume thin film products, advanced high density thin film multilayer interconnects and circuits customized for aerospace/defense, homeland security, electronic medical devices applications, piezoelectric actuators, I/R imaging, sensor, hermetic seal metallization, resistive heaters for optical lenses, telecommunications infrastructure, fiber optics, broadband networking, test and measurement, and many other specialty electronic applications. UltraSource, Inc. is headquartered in Hollis, NH, USA. Additional information is available at www.ultrasource.com.
Contacts:
Corporate Communications Manager
Dawn Hallett
603-881-7799
