UltraSource, Inc. a supplier of custom thin film circuits and ceramic interconnect devices, has unveiled their new Technology Platform. UltraSource’s Technology Platform provides designers with the opportunity to pursue innovative ideas for solving the most challenging design problems.

These modular processes can be tailored to meet precise specifications and provide cost-effective and versatile solutions.This sophisticated collection of design solutions and modular processes include basic single layer components for chip and wire design, integrated multilevel passives, and complex, high density, multilayer circuits. The collection has now been organized into the UltraSource Technology Platform to provide designers with the most comprehensive suite of customizable thin film solutions available anywhere. The Platform includes four solutions. Basic solutions consist of conventional single and double sided designs. Integrated solutions allow our customers to select from the UltraVia™, UltraBridge®, UltraCapacitor®, or UltraInductor® suite of solid state passive elements to provide higher levels of passive integration. The Multilayer solution provides a 5 layer system that includes 3 layers of custom patterned gold conductors separated by 2 layers of polyimide dielectric. The Advanced solution combines the Basic or Integrated solutions on one side, and the Multilayer on the other. For more information visit www.ultrasource.com.