Visit Us At Booth #611 – IMS 2013

UltraSource will have a booth at IMS 2013, June 4-6 in Seattle, Washington. Visit us and enter to win an iPad Mini!

Here’s What’s New At UltraSource

• Backside Burnishing Technique for Substrates

• How CAD File Quality Affects Thin Film Design Success

• CopperVia Process for Thin Film – Improve Thermal & Electrical Conductivity with Pure Copper

• Polyimide – Unlock the Potential of your Thin Film Design

• Ultra-Thin is In! – UltraSource fabricates Ultra-Thin circuits on 3 mil (75 micron), 4 mil (100 micron), and 5 mil (125 Micron substrates.