RAPID PROTOTYPING

UltraFast® Rapid Prototyping

Rather than waiting weeks for your critical prototypes, UltraSource is guaranteeing them in a matter of days, cutting your time to market, improving the integrity of your designs, and ensuring long-term repeatability as you hone your designs to perfection.

UltraFast® Rapid Prototyping Program Details

This is the new economy. Time is the biggest enemy of designers creating the next generation of breakthrough products. Since 2010, the UltraFAST® program has enabled our customers to bring their products to market faster than ever before at an amazing 99.9% on-time delivery!

To meet the challenge of these aggressive deliveries, we’ve dedicated an entire team to the task of creating a streamlined manufacturing approach. With our expertise, you’ll be testing your prototypes faster than ever before. In addition, UltraFAST® is designed to offer a selective range of standard single-sided and double-sided designs compatible with a broad range of traditional thin film circuit requirements. The substrate choices, metalization systems, and integration options have also been selected to allow you to further increase device function and performance while reducing prototyping costs.

Thin film chip attenuators

The Approach

In evaluating the varying requirements of our customers, UltraSource has identified four circuit types for rapid prototyping:

  • 4 Days: 1-Sided Conductor
  • 5 Days: 2-Sided Conductor
  • 6 Days: 1-Sided Conductor with Resistors
  • 7 Days: 2-Sided Conductor with Resistors

The Possiblities

At UltraSource, we specialize in working with our customers in order to provide innovative products and services. We realize that the standard options available through the UltraFAST® program may not provide the requirements for every customer.

If you need a metal, material, or features that are not listed in the UltraFAST® standard options, please contact your local sales representative or our corporate sales office to discuss how we can customize a rapid prototype program for you.

UltraFAST® RAPID PROTOTYPING SPECIFICATIONS

Standard Order & Design Criteria

To Quote & Order Enlist in the Standard or Custom UltraFAST® program by contacting your USI Sales Representative
Standard Pricing Per the UltraFAST® Price List
NRE Charges FREE (included in pricing)
Shipping FREE (included in pricing)
Design Rules Per the Furnished UltraFAST® Design Templates

Standard Material & Metalization Criteria

Available Substrate Materials Polished 99.6% Alumina Polished Aluminum Nitride
Substrate Thicknesses 5, 10, 15, and 25 mil thicknesses 5, 10, 15, and 25 mil thicknesses
Available Front Side
Metalization Schemes
Option 1: 50 Ω/sq. TaN/500 Å WTi/4 μm Au

Option 2: 500 Å WTi/4 μm Au

Option 1: 50 Ω/sq. TaN/500 Å WTi/4 μm Au
(not available on AlN with PTH)
Option 2: 500 Å WTi/4 μm Au
Available Back Side
Metalization Scheme
500 Å WTi/4 μm Au 500 Å WTi/4 μm Au
Minimum Line or Spacing .001″ (25 μm) .001″ (25 μm)
Pattern & Etch Tolerance +/- .0002” (+/- 5 μm) +/- .0002” (+/- 5 )

Standard Product Type Criteria

Product Type Conductor Layer
on 1 Side Only
Conductor Layer
on 2 Sides (front & back)
Conductor & Resistor Layer
on 1 Side Only
Conductor Layer
on 2 Sides (front & back)
plus Resistor Layer
Build Time 4 working days 5 working days 6 working days 7 working days
Quantities Yield from 2 substrates* Yield from 2 substrates* Yield from 2 substrates* Yield from 2 substrates*
Back Side Metal None Yes None Yes

* Limited to 50 individual pieces per part number

Standard Options Criteria

Options Comments Build Time
Multiple P/N Design (Pizza Masking) Allows for prototyping of a maximum of 4 part numbers on the same photo & substrate + 2 or 4 working days added to standard build times depending on complexity
CopperVia™ Provides assembly, thermal, or transmission benefits from solid copper filled vias,
includes custom sputtering (not available in 5 mil ceramic thickness)
+ 15 working days added to standard build times
Plated Thru Holes (PTH) Offers grounding of selected circuit features, includes custom sputtering + 5 working days added to standard build times
Post Laser Features Allows chamfers, pockets, or radii to be added to circuit features + 2 working days added to standard build times
Laser Trimming Offers the ability to trim individual resistors to +/- 1% tolerances + 2 working days added to standard build times
CAD Conversion Convert supplied CAD drawing(s) into format suitable for UltraFAST® + 1 or 2 working days added to standard build times depending on complexity

NOTE: Please contact USI for current pricing, delivery, and option offerings.