When high reliability bonding is desired, it is ideal to “burnish” the mating surfaces so the epoxy has a mechanical pattern for the epoxy to “key” into. Backside burnishing is a unique backside metallization treatment developed at UltraSource to enhance the adherence of thin film components to carriers by epoxies.

Backside burnishing results in a backside metallization surface that has greatly improved adhesion over standard metalization schemes. This surface modification technique provides a cross-hatched 3-5 microinch surface finish that allows the epoxy to attach itself securely and key into the texture of the surface, therefore reducing delaminating and peeling issues. This method of attachment has proven to be effective with substrates attached to carriers or metal housings.