PECVD dielectric film deposition

Jan 9, 2017

USI uses a plasma enhanced chemical vapor deposition (PECVD) tool to deposit silicon nitride films for use in integrated capacitors or as a dielectric layer for multilayer thin film devices such as the UltraBridge.

2017-05-01T15:21:32-04:00January 9th, 2017|Services|0 Comments

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