Spec Control Drawing Requirements
- Part size dimensions with tolerance, scale, units and smallest feature size clearly noted.
- Metal layers must include the following details by order. Thickness and tolerance must be listed:
Resistor Layer 50Ω/sq. TaN, TCR -100±50ppm/°C - Conductor Layer
- Tungsten-Titanium (WTi):
- Nickel (Ni):
- Gold (Au):
- 500Å ± 100
- 2,000Å ± 500
- 100µ” ± 25µ”
Solder Layer 4±1µm Pre-deposited 73/27 AuSn - Ground Plane
- Tungsten-Titanium (WTi)
- Gold (Au):
- 500Å ± 100
- 100µ” ± 25µ”
- Substrate thickness, tolerance and finish must be identified:
Alumina, as-fired 99.6% Thickness 0.025″±0.002″ Surface Finish <4µ” CLA Camber 0.001″/” - Specialty inspection requirements should be listed (i.e. bake testing, TCR).
- Customer name, customer part number and revision level must be listed on SCD.
- Resistance and/or capacitance charts should be provided:
Resistor Nominal (Ω) TOL Length Width R1, R4 18.8 +5/-20% .0150 .0400 R2, R5 15 +5/-20% .0150 .0500 R3, R6 12.5 +5/-20% .0150 .0600 R7, R10 16.5 +5/-20% .0150 .0450 R8, R11 25 +5/-20% .0150 .0300 R9, R12 50 +5/-20% .0150 .0150 R13, R16 50 +5/-20% .0450 .0450 R14, R17 16.5 +5/-20% .0150 .0450 R15, R18 11 +5/-20% .0100 .0450 R19, R22 25 +5/-20% .0200 .0400 R20, R21 12.5 +5/-20% .0100 .0400 - Additional layers thickness and tolerance must be called out (i.e. SiN, polyimide).
Dielectric layer 20,000Å ± 5,000Å Si3N4 - Additional layer properties must also be called out (i.e. 80/20 Au/Sn versus 70/30 Au/Sn).
Solder layer 4±1µm Pre-deposited over 73/27 AuSn - All pullbacks should be identified and dimensioned.
- Plating requirements must be defined.
- Front to back registration tolerance should be listed when applicable.
- Camber requirements should be listed.
- Filled vias must specify material Eg: Gold, Copper Tungsten, etc.
- Plated through-hole and via locations, diameters, and tolerances should be dimensioned.
