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So far Thin Film has created 77 blog entries.

UltraBridge – The Alternative to Wire Bonding

Experience Our Reliable Quality, Service, and Value The UltraBridge was developed at UltraSource in 2005 to provide a reliable, cost effective solution for interconnecting thin lines in Coupler devices (see Figure 1 at side) and providing our customers with very repeatable, high frequency performance. A Lange Coupler is a microwave device [...]

2017-02-15T21:18:30-05:00October 15th, 2013|News|0 Comments

“Christmas in July” UltraSource Supports Nashua Soup Kitchen, Nashua, NH

USI employees celebrated "Christmas in July" by donating non-perishable food items, canned goods, toiletries, children's snacks, baby food, and household goods. This year the donation went to the Nashua Soup Kitchen, one of USI's local corporate charities of choice recipients. The Soup Kitchen reminds us that summer months are also a time of need [...]

2017-02-15T22:22:34-05:00July 15th, 2013|News|0 Comments

UltraSource to present thin film circuit design solutions at IMS 2013

UltraSource Inc., an industry leader in delivering thin film on ceramic manufacturing solutions, will be showcasing several of its technologies at this year's IMS 2013 held at the Washington State Convention Center in Seattle, Washington June 4-6. UltraSource will be located at Booth #611 and be on hand to speak about a wide range of [...]

2017-02-15T22:58:32-05:00May 1st, 2013|News|0 Comments

Thin is In! (And We Can Help)

For many years, thin film technology has been used as an enabling fabrication technique for RF and microwave circuitry due to the technology's excellent line resolution, superb microwave substrate properties, and highly reliable construction. As transmission frequencies push higher and higher to gain broader bandwidth and higher data flows, designers of microstrip and coplanar thin [...]

2017-02-15T21:42:32-05:00April 15th, 2013|News|0 Comments

UltraSource, Inc. – Adds Zero Sort Recycling Program to Facility

Hollis, NH, April 8, 2013: UltraSource, Inc. a thin film microchip manufacturer is pleased to announce the addition of a Zero Sort Recycling Program to their facility.When it came time to renegotiate the trash hauling contract for UltraSource, Arthur Pearce, Facilities, Equipment & Safety Manager, wanted to make sure that UltraSource was not only getting the [...]

2017-02-15T22:19:59-05:00April 8th, 2013|News|0 Comments

Polyimide – Unlock the Potential of Your Thin Film Design

Polyimide Goes Mainstream New fabrication techniques that improve performance, lower assembly costs, or reduce size are always of interest. Enter Polyimide!  Polyimide is a polymer material known for its thermal stability, good chemical resistance, excellent mechanical properties, and characteristic orange/yellow color. The cured film properties of polyimide allow it to be used as [...]

2017-02-15T21:48:24-05:00March 15th, 2013|News|0 Comments

How Your CAD File Affects the Success of Your New Thin Film Design

One key to reducing time to market and ensuring on-time delivery of your thin film designs is to be sure your CAD files follow industry standards and generally accepted good practices. To help customers understand how to ensure their CAD files are formatted and drawn as needed, UltraSource has updated a CAD File application [...]

2017-02-15T21:58:24-05:00February 15th, 2013|News|0 Comments

Presentation to Future Entrepreneurs of Financial Algebra Class

Soughegan High School, Amherst, NH Michael Casper, President & CEO of UltraSource , a guest speaker in Ms Jennifer Bonsu-Anane's Financial Algebra class delivered a presentation to 11th & 12th graders on "Modeling a Business". Casper covered information about UltraSource and thin film manufacturing along with some of the high tech applications [...]

2017-02-15T22:30:58-05:00February 5th, 2013|News|0 Comments

UltraSource releases new thin film microcircuit CopperVia

VIEW SOURCE: Microwave Journal Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The CopperVia was first introduced at the June2012 IEEE MTT-S International Microwave Symposium/Exhibition inMontreal, Quebec, Canada. UltraSource’s new CopperVia process fills [...]

2017-02-15T23:10:41-05:00January 16th, 2013|News|0 Comments
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