Conductor / Resistor Films

A basic understanding of thin film resistor design is required if you want to integrate sheet resistors into your circuit. Thin film sheet resistors are typically fabricated by sputtering a film of Tantalum-Nitride (TaN) under the conductor layer and then selectively etching the resistor elements. TaN resistors are very stable and reliable after they [...]

2017-06-18T22:22:14+00:00 February 14th, 2017|Design Guidelines|0 Comments

Substrate Material Properties

The substrate is the foundation on which the thin film components are built. The substrate properties have significant influence on the performance of the device. Alumina is still the most common substrate material due to its surface quality, cost, and high frequency performance. For power applications, Aluminum Nitride and BeO substrates are still the [...]

2017-02-14T16:57:07+00:00 February 13th, 2017|Design Guidelines|0 Comments

Plated Through-Holes and Filled Vias

Plated Through Holes and Filled Vias UltraSource offers two options for pass-through conductance. First, we offer highly reliable plated through-holes, with diameters as low as 50% of the substrate thickness. These through-holes are laser drilled, de-slagged and repetitively cleaned for optimum metallization adhesion, and they are sputtered from each substrate side for maximum [...]

2017-02-15T15:21:53+00:00 February 4th, 2017|Design Guidelines|0 Comments

Preparing CAD Files for Thin Film Circuit Production

UltraSource has a talented team of CAD professionals to convert your CAD designs from specification control drawings (spec drawings) into the various documents needed for thin film processing. To facilitate these documents, we request that you incorporate the following information and design guidelines in your CAD package so that we may accurately process [...]

2017-02-14T17:39:16+00:00 January 30th, 2017|Design Guidelines|0 Comments