UltraSource, Inc. (USI) announced today that it has developed a reduced cost plugged via option called PolyVia. PolyVia was recently showcased at the IEEE-IMS, Tampa Bay, on June 3-5. The PolyVia product is a [...]

Michael Casper, President & CEO of UltraSource, Inc. an industry leader in delivering thin film on ceramic microchip manufacturing solutions is pleased to announce the formalized addition of a new fabrication processing note on their [...]

Try us and Experience Our Reliable Quality, Service, and Value Many of our customers are high technology market leaders who demand 100% on-time shipping (OTS) and quality from their supply chain. As [...]

Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource, Inc. is featured in the publication titled “Microwave and Millimeter‐Wave Electronic Packaging” by Rick Sturdivant [...]

The metallization that you select for your next thin film design is critical to the success of that product. The metallization scheme is defined as the metal layers that make up the lines and features on [...]

As designers of the next generation of wireless, telecommunications, and RF/microwave products, you know time is the enemy. Enter UltraFAST®, the first and only thin film prototyping program of its kind. Rather than waiting weeks or [...]