UltraSource, Inc. Releases Capabilities Addition on Ultra-Thin Substrates

Michael Casper, President & CEO of UltraSource, Inc. an industry leader in delivering thin film on ceramic microchip manufacturing solutions is pleased to announce the formalized addition of a new fabrication processing note on their [...]

June 15th, 2014|Categories: News|

UltraSource, Inc. Featured in Publication “Microwave and Millimeter‐Wave Electronic Packaging”

Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource, Inc. is featured in the publication titled “Microwave and Millimeter‐Wave Electronic Packaging” by Rick Sturdivant [...]

March 13th, 2014|Categories: News|
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