UltraSource Thin Film Circuit Manufacturing Services
UltraSource routinely works with customer CAD data in DXF, AutoCAD DWG, Gerber, or GDS formats. We translate and repair customer CAD designs created in the different CAD systems in order to make it usable in manufacturing.
Customer supplied CAD designs are drafted into a step & repeat pattern in order to maximize substrate yield and provide the lowest cost and highest quality thin film devices. Etch factors, alignment features, and photomask polarity are added according to the specific thin film process and/or substrate requirements.
UltraSource is an expert at working with the following substrates: Alumina Quartz/Fused Silica Aluminum Nitride Beryllium Oxide Ferrite/Garnet Titanates Glass Sapphire Silicon
UltraVia™ To meet a variety of customer identified challenges, UltraSource has developed a new filled via product, the UltraVia™. This patented technology uses pure metal filled via materials that are bonded directly into the ceramic vias to provide a robust, highly conductive, highly reliable connection in thin film substrates. The UltraVia improves on…
Tantalum nitride films are reactively sputtered in order to provide highly stable resistor films with low temperature coefficient of resistance (TCR) performance. Nichrome films are also available.
Gold or ENEPIG plating can be added to sputtered films for applications when plating is required. Gold plating is used to build up thin film coatings and ENEPIG is used to provide solderability and wire bondability from the same metallization.
Photoresist, the photo-sensitive coating that enables patterning, is applied to thin film substrates via a robotic spray system.
Custom mask aligners and tooling are used to ensure that front side and back side patterns are aligned to each other to within ± 24 microns (± .001”) of each other.
UltraSource, Inc. provides thin film metalization and patterning services that allow our customers to hermetically seal windows and lenses into optical, laser, and infrared assemblies. Our unique thin film metalization and patterning processes apply solderable metal coatings that provide hermetic integrity against a variety of the tough applications like space,…
Photolithography is the process of using light to transfer images from a photomask to a coated thin film substrate. The key to the process is the use of a light-sensitive chemical called photoresist and a precision phototool, called a photomask. The photomask is custom tooling made from customer CAD files.
In Lange Couplers and similar devices where there is a need to replace wirebonds with a robust cross-over, we often use polyimide as a permanent cross-over. Cross-overs supported by polyimide provide a rugged, highly reliable structure. Polyimide offers the ability to build up multiple layers of circuitry and dielectric on…
USI uses a plasma enhanced chemical vapor deposition (PECVD) tool to deposit silicon nitride films for use in integrated capacitors or as a dielectric layer for multilayer thin film devices such as the UltraBridge.
CO2 lasers are used by directing the output of a high power laser through a series of optics working with a CNC system to enable machining of various thin film substrates. The 75 micron diameter laser beam is used to machine the substrate. Substrate material subjected to the laser beam…
Laser trimming is a process that uses a 20 micron diameter laser to ablate or burn away small portions of an individual resistor, raising the resistance value into the required tolerance value.
When high reliability bonding is desired, it is ideal to “burnish” the mating surfaces so the epoxy has a mechanical pattern for the epoxy to “key” into. Backside burnishing is a unique backside metallization treatment developed at UltraSource to enhance the adherence of thin film components to carriers by epoxies….
Gold-tin solder is deposited onto the thin film substrates and then patterned in order to place precise geometries of solder exactly where they are needed. This service eliminates the need for purchasing and/or dispensing solder preforms or paste.
Dicing is the process of using high speed diamond blades and cooling water to saw through thin film substrates in order to singulate the individual devices.
A First Article Inspection (FAI) is a formal method of providing a reported measurement for all dimensions and requirements listed on a fabrication drawing. Despite the name, the inspected article may not necessarily be the ‘first’ produced, but one random device chosen from each manufacturing lot. Items to be checked…