Loading...
Services 2017-05-01T15:13:35+00:00

What We Offer

Team Up With UltraSource and Chart a Course for the Future

When you choose UltraSource as your thin film manufacturing partner you get more than a world-class design, manufacturing and processing facility at your service, you get to take advantage of the latest innovations in thin film today. Innovations and technology that will not only help you solve critical size/performance issues, but will also allow you the freedom to integrate the latest and most advanced multilayer thin film techniques and functions into your RF and microwave circuit and component designs.

Various custom thin film samples

UltraSource Thin Film Circuit Manufacturing Services

CAD Translation

UltraSource routinely works with customer CAD data in DXF, AutoCAD DWG, Gerber, or GDS formats. We translate and repair customer CAD designs created in the different CAD systems in order to make it usable in manufacturing.

$postTitle

Photomask Layout & Design

Customer supplied CAD designs are drafted into a step & repeat pattern in order to maximize substrate yield and provide the lowest cost and highest quality thin film devices. Etch factors, alignment features, and photomask polarity are added according to the specific thin film process and/or substrate requirements.

$postTitle

Substrates

UltraSource is an expert at working with the following substrates: Alumina Quartz/Fused Silica Aluminum Nitride Beryllium Oxide Ferrite/Garnet Titanates Glass Sapphire Silicon

$postTitle

Vias

UltraVia™ To meet a variety of customer identified challenges, UltraSource has developed a new filled via product, the UltraVia™. This patented technology uses pure metal filled via materials that are bonded directly into the ceramic vias to provide a robust, highly conductive, highly reliable connection in thin film substrates. The UltraVia improves on…

READ MORE

$postTitle

Sputtering of Resistor Films

Tantalum nitride films are reactively sputtered in order to provide highly stable resistor films with low temperature coefficient of resistance (TCR) performance. Nichrome films are also available.

$postTitle

Plating

Gold or ENEPIG plating can be added to sputtered films for applications when plating is required. Gold plating is used to build up thin film coatings and ENEPIG is used to provide solderability and wire bondability from the same metallization.

$postTitle

Photoresist Spray Coat

Photoresist, the photo-sensitive coating that enables patterning, is applied to thin film substrates via a robotic spray system.

$postTitle

Front to Back Alignment

Custom mask aligners and tooling are used to ensure that front side and back side patterns are aligned to each other to within ± 24 microns (± .001”) of each other.

$postTitle

Metalized Windows

UltraSource, Inc. provides thin film metalization and patterning services that allow our customers to hermetically seal windows and lenses into optical, laser, and infrared assemblies. Our unique thin film metalization and patterning processes apply solderable metal coatings that provide hermetic integrity against a variety of the tough applications like space,…

READ MORE

$postTitle

Photolithography

Photolithography is the process of using light to transfer images from a photomask to a coated thin film substrate. The key to the process is the use of a light-sensitive chemical called photoresist and a precision phototool, called a photomask. The photomask is custom tooling made from customer CAD files.

$postTitle

Polyimide Processing

In Lange Couplers and similar devices where there is a need to replace wirebonds with a robust cross-over, we often use polyimide as a permanent cross-over. Cross-overs supported by polyimide provide a rugged, highly reliable structure. Polyimide offers the ability to build up multiple layers of circuitry and dielectric on…

READ MORE

$postTitle

PECVD dielectric film deposition

USI uses a plasma enhanced chemical vapor deposition (PECVD) tool to deposit silicon nitride films for use in integrated capacitors or as a dielectric layer for multilayer thin film devices such as the UltraBridge.

$postTitle

Laser Machining

CO2 lasers are used by directing the output of a high power laser through a series of optics working with a CNC system to enable machining of various thin film substrates. The 75 micron diameter laser beam is used to machine the substrate. Substrate material subjected to the laser beam…

READ MORE

$postTitle

Laser Trimming

Laser trimming is a process that uses a 20 micron diameter laser to ablate or burn away small portions of an individual resistor, raising the resistance value into the required tolerance value.

$postTitle

Backside Burnishing

When high reliability bonding is desired, it is ideal to “burnish” the mating surfaces so the epoxy has a mechanical pattern for the epoxy to “key” into. Backside burnishing is a unique backside metallization treatment developed at UltraSource to enhance the adherence of thin film components to carriers by epoxies….

READ MORE

$postTitle

Gold-Tin Patterned Solder

Gold-tin solder is deposited onto the thin film substrates and then patterned in order to place precise geometries of solder exactly where they are needed. This service eliminates the need for purchasing and/or dispensing solder preforms or paste.

$postTitle

Dicing

Dicing is the process of using high speed diamond blades and cooling water to saw through thin film substrates in order to singulate the individual devices.

$postTitle

First Article Inspection

A First Article Inspection (FAI) is a formal method of providing a reported measurement for all dimensions and requirements listed on a fabrication drawing. Despite the name, the inspected article may not necessarily be the ‘first’ produced, but one random device chosen from each manufacturing lot. Items to be checked…

READ MORE

$postTitle