The substrate is the foundation on which the thin film components are built. The substrate properties have significant influence on the performance of the device. Alumina is still the most common substrate material due to its surface quality, cost, and high frequency performance. For power applications, Aluminum Nitride and BeO substrates are still the choices. [...]

2017-05-01T15:19:12-04:00February 8th, 2017|Services|0 Comments


UltraVia™ To meet a variety of customer identified challenges, UltraSource has developed a new filled via product, the UltraVia™. This patented technology uses pure metal filled via materials that are bonded directly into the ceramic vias to provide a robust, highly conductive, highly reliable connection in thin film substrates. The UltraVia improves on existing filled via technologies [...]

2017-05-01T15:19:31-04:00January 30th, 2017|Services|0 Comments


Gold or ENEPIG plating can be added to sputtered films for applications when plating is required. Gold plating is used to build up thin film coatings and ENEPIG is used to provide solderability and wire bondability from the same metallization.

2017-05-01T15:20:06-04:00January 20th, 2017|Services|0 Comments

Metalized Windows

UltraSource, Inc. provides thin film metalization and patterning services that allow our customers to hermetically seal windows and lenses into optical, laser, and infrared assemblies. Our unique thin film metalization and patterning processes apply solderable metal coatings that provide hermetic integrity against a variety of the tough applications like space, infrared signal transmission, and medical [...]

2017-05-01T15:17:46-04:00January 15th, 2017|Services|0 Comments
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