UltraSource is a sub-division of Vishay Intertechnology, Inc. | 22 Clinton Drive • Hollis, NH 03049
Have you seen the news? Yes, we have lots of snow here in New England – and more on the way! Our snow banks may be high – but – we are open for business here in snowy New Hampshire! Although we have over another foot of new snow to clear, [...]
Prestigious ISO Certification UltraSource, Inc. is proud to announce its certification to AS9100C by TÜV SÜD America, effective November 11, 2014. UltraSource selected TÜV SÜD America for our AS9100C certification because they are an internationally accredited certification services firm and a leading management system Registrar in North America, Europe, and Asia. [...]
UltraSource, Inc. (USI) announced today that it has developed a reduced cost plugged via option called PolyVia. PolyVia was recently showcased at the IEEE-IMS, Tampa Bay, on June 3-5. The PolyVia product is a polyimide-based plugged via option that customers can add to their plated-through hole designs in order to stop epoxy or solder [...]
Michael Casper, President & CEO of UltraSource, Inc. an industry leader in delivering thin film on ceramic microchip manufacturing solutions is pleased to announce the formalized addition of a new fabrication processing note on their website under Capabilities/Solutions titled: Ultra-Thin Substrates -- "Thin is In! (And We Can Help)". For many years, thin film technology [...]
Try us and Experience Our Reliable Quality, Service, and Value Many of our customers are high technology market leaders who demand 100% on-time shipping (OTS) and quality from their supply chain. As a custom thin film job shop, achieving 100% performance takes extraordinary commitment to building and executing a reliable order fulfillment [...]
Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource, Inc. is featured in the publication titled “Microwave and Millimeter‐Wave Electronic Packaging” by Rick Sturdivant and published by Artech House. Author, Rick Sturdivant, has over 20 years of industry experience in designing modules, packages, and [...]
The metallization that you select for your next thin film design is critical to the success of that product. The metallization scheme is defined as the metal layers that make up the lines and features on a thin film circuit or interconnect. A typical metallization scheme consists of an adhesive layer, a solder layer, and a [...]
As designers of the next generation of wireless, telecommunications, and RF/microwave products, you know time is the enemy. Enter UltraFAST®, the first and only thin film prototyping program of its kind. Rather than waiting weeks or months for your critical prototypes, UltraSource is fabricating them in a matter of days—cutting your time to market as you [...]
Experience Our Reliable Quality, Service, and Value NOTE: In order to serve you best with our e-newsletters, we want to hear from YOU on which specific thin film or design or manufacturing topics you want to learn more about. Please email me directly with your ideas or topics of interest at mcasper@ultrasource.com. [...]
ENEPIG ENEPIG is a surface finish system that is compatible with both gold and aluminum wire bonding, but also provides high-strength soldering. ENEPIG eliminates reliability issues related to reduced solder joint strength with gold (embrittlement). ENEPIG is the acronym for Electroless Nickel (EN) Electroless Palladium (EP) Immersion Gold (IG). ENEPIG, defined in specification [...]
