Thin is In! (And We Can Help)
For many years, thin film technology has been used as an enabling fabrication technique for RF and microwave circuitry due to the technology's excellent line resolution, superb microwave substrate properties, and highly reliable construction. As [...]
UltraSource, Inc. – Adds Zero Sort Recycling Program to Facility
Hollis, NH, April 8, 2013: UltraSource, Inc. a thin film microchip manufacturer is pleased to announce the addition of a Zero Sort Recycling Program to their facility.When it came time to renegotiate the trash hauling contract [...]
Polyimide – Unlock the Potential of Your Thin Film Design
Polyimide Goes Mainstream New fabrication techniques that improve performance, lower assembly costs, or reduce size are always of interest. Enter Polyimide! Polyimide is a polymer material known for its thermal stability, good chemical [...]
How Your CAD File Affects the Success of Your New Thin Film Design
One key to reducing time to market and ensuring on-time delivery of your thin film designs is to be sure your CAD files follow industry standards and generally accepted good practices. To help customers [...]
Presentation to Future Entrepreneurs of Financial Algebra Class
Soughegan High School, Amherst, NH Michael Casper, President & CEO of UltraSource , a guest speaker in Ms Jennifer Bonsu-Anane's Financial Algebra class delivered a presentation to 11th & 12th graders on [...]
UltraSource releases new thin film microcircuit CopperVia
VIEW SOURCE: Microwave Journal Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The [...]