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So far Thin Film has created 77 blog entries.

Vias

UltraVia™ To meet a variety of customer identified challenges, UltraSource has developed a new filled via product, the UltraVia™. This patented technology uses pure metal filled via materials that are bonded directly into the ceramic vias to provide a robust, highly conductive, highly reliable connection in thin film substrates. The UltraVia improves on existing filled via technologies [...]

2017-05-01T15:19:31-04:00January 30th, 2017|Services|0 Comments

UltraSource Inc – Management Tool #2: Employee Training & Certification

USI's Management Tools This newsletter is #3 in a 10-part series to explain the 10 great management tools that we use to help us be the thin film circuit supplier that you can really depend on. Continuous Improvement Employee Training & Certification On-Time Shipping Infrastructure ITAR Controls Change Controls & Certification [...]

2017-04-19T11:46:25-04:00January 30th, 2017|News|0 Comments

Preparing CAD Files for Thin Film Circuit Production

UltraSource has a talented team of CAD professionals to convert your CAD designs from specification control drawings (spec drawings) into the various documents needed for thin film processing. To facilitate these documents, we request that you incorporate the following information and design guidelines in your CAD package so that we may accurately process [...]

2017-02-14T17:39:16-05:00January 30th, 2017|Design Guidelines|0 Comments

Management Tool #1 is: Continuous Improvement

USI's Management Tools This newsletter is #3 in a 10-part series to explain the 10 great management tools that we use to help us be the thin film circuit supplier that you can really depend on. Continuous Improvement Employee Training & Certification On-Time Shipping Infrastructure ITAR Controls Change Controls & Certification [...]

2017-08-02T17:22:25-04:00January 23rd, 2017|News|0 Comments
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