New fabrication techniques that improve performance, lower assembly costs, or reduce size are always of interest. Enter Polyimide! Polyimide is a polymer material known for its thermal stability, good chemical resistance, excellent mechanical properties, and characteristic orange/yellow color. The cured film properties of polyimide allow it to be used as dielectric features in thin film [...]
USI uses a plasma enhanced chemical vapor deposition (PECVD) tool to deposit silicon nitride films for use in integrated capacitors or as a dielectric layer for multilayer thin film devices such as the UltraBridge.
CO2 lasers are used by directing the output of a high power laser through a series of optics working with a CNC system to enable machining of various thin film substrates. The 75 micron diameter laser beam is used to machine the substrate. Substrate material subjected to the laser beam melts and the molten slag [...]
Laser trimming is a process that uses a 20 micron diameter laser to ablate or burn away small portions of an individual resistor, raising the resistance value into the required tolerance value.
When high reliability bonding is desired, it is ideal to "burnish" the mating surfaces so the epoxy has a mechanical pattern for the epoxy to "key" into. Backside burnishing is a unique backside metallization treatment developed at UltraSource to enhance the adherence of thin film components to carriers by epoxies. Backside burnishing results in a [...]
Gold-tin solder is deposited onto the thin film substrates and then patterned in order to place precise geometries of solder exactly where they are needed. This service eliminates the need for purchasing and/or dispensing solder preforms or paste.
Dicing is the process of using high speed diamond blades and cooling water to saw through thin film substrates in order to singulate the individual devices.
A First Article Inspection (FAI) is a formal method of providing a reported measurement for all dimensions and requirements listed on a fabrication drawing. Despite the name, the inspected article may not necessarily be the 'first' produced, but one random device chosen from each manufacturing lot. Items to be checked in a FAI are wide [...]