Cross Section of a pure gold UltraVia™
Cross Section of a pure copper CopperVia™
PolyVia cross-section viewed at 80x magnification.
To meet a variety of customer identified challenges, UltraSource has developed a new filled via product, the UltraVia™. This patented technology uses pure metal filled via materials that are bonded directly into the ceramic vias to provide a robust, highly conductive, highly reliable connection in thin film substrates. The UltraVia improves on existing filled via technologies by virtually eliminating epoxy or solder bleed-through while enhancing via conductivity and reliability.
In direct response to customer requests for lower cost and higer performance, UltraSource has developed a new filled via product, the CopperVia™. This new technology, based on the patented UltraVia process, fills the vias with pure copper material in order to provide a low cost, highly conductive, extremely reliable electrical and thermal path on ceramic substrates. Like it’s sister technology, UltraVia™ , the CopperVia™ virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.
The PolyVia product is a polyimide-based plugged via option that customers can add to their plated-through hole designs in order to stop epoxy or solder bleed-thru during assembly operations. The technology uses a polyimide resin that is deposited into each plated–through hole and then cured. Once cured, the PolyVia plugs exhibit excellent adhesion and thermal stability to gold and other thin film metal films. The PolyVia system eliminates epoxy or solder bleed-through but at a much lower cost than the pure metal filled via products like UltraVia, CopperVia, or Hi-Rel CopperVia that UltraSource offers.